TECH SUPPLIER Jan 2023 - Market Perspective - Doc # AP48503522
Part 2: Developing Realistic Expectations for AR/VR — Device Considerations
This IDC Market Perspective investigates the challenges in mass-market augmented reality/virtual reality/extended reality (AR/VR/XR) devices by studying the role of sensors, onboard algorithms, semiconductor processor functionality, battery consumption, and thermal signature. AR/VR/XR devices are making great strides with the emergence of SoC chipsets from semiconductor companies that provide image, graphic, and neural network processing along with support for multiple cameras and numerous sensors. Advances in lithography are making it possible to pack a significant amount of compute and storage in small form factors such as would be needed in smart AR glasses. Mixed reality is an important class of use cases that will drive more and more innovation in device design including advanced algorithms for gaze tracking, eye tracking, gesture recognition, and facial expression recognition. Price elasticity will have a wider band to work with since premium smartphones are approaching US$1,000 per unit.
"Therefore, IDC believes that mass-market devices will become a reality within three to five years and will also benefit from developments with the metaverse," says Bill Rojas, adjunct research director, IDC Asia/Pacific.
Asia/Pacific Internet of Things and Intelligent Edge: Infrastructure
Texas Instruments Incorporated, Meta Platforms Inc., NVIDIA Corporation, Spectra7 Microsystems Inc., Intel Corporation, Andes Technology Corporation, MediaTek Inc., Imagination Technologies Group Ltd., ARM Limited, Google LLC, Apple Inc., Sony Corporation, Advanced Micro Devices, Inc., CEVA Inc., Qualcomm Inc., Magic Leap, Inc., Huawei Technologies Co., Ltd., Microsoft Corporation, SiFive Inc.
Augmented and virtual reality, Internet of things, NAND, Power management ICs, RFFE, Wearable technologies, Wireless and mobile infrastructure
List of Tables
List of Figures
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