target audience: TECH SUPPLIER  Publication date: Nov 2023 - Document type: Technology Assessment - Doc  Document number: # US50502623

Semiconductor Advanced Packaging Technology and Market Assessment, 2023

By:  Galen Zeng

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Content

List of Tables

List of Figures



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Table of Contents


  • IDC Opinion

  • In This Study

    • Methodology

  • Situation Overview

    • Market Snapshot

    • Figure: Packaging Market Share, 2021–2023

    • Table: Classification of General Packaging Technologies

    • Figure: Advanced Packaging Market Revenue, 2021–2023

    • Figure: Revenue of Advanced Packaging Technologies, 2021–2023

    • Advanced Packaging Technologies of Major Manufacturers

    • TSMC

    • Figure: 3DFabric Portfolio

    • Samsung

    • Figure: Samsung Advanced Heterogeneous Integration

    • Intel

    • Figure: Intel Advanced Packaging Portfolio

    • ASE Group

    • Figure: ASE Group’s VIPack Comprising Six Core Packaging Technologies

  • Future Outlook

    • Chiplet

    • Figure: UCIe Standard

    • Hybrid Bonding

  • Essential Guidance

  • Learn More

    • Related Research

    • Synopsis