target audience: TECH SUPPLIER Publication date: Nov 2023 - Document type: Market Forecast - Doc Document number: # US50501823
Worldwide Semiconductor Advanced Packaging Technology Market Forecast and Analysis, 2023–2028
Content
List of Tables
List of Figures
Get More
When you purchase this document, the purchase price can be applied to the cost of an annual subscription, giving you access to more research for your investment.
Related Links
Abstract
This IDC study provides a comprehensive market analysis including key vendors, technology trends, application areas, and competitive scenarios. It is worth mentioning that large enterprises such as TSMC, Samsung, Intel, and ASE occupy an important position in the advanced packaging market and play a core role in the field of advanced packaging by virtue of technologies including flip chip (FC), system-in-package (SiP), fan in/fan out (FI/FO), 2.5D/3D, chiplet, and hybrid bonding.
According to Galen Zeng, senior research manager at IDC, "Against the backdrop of semiconductor technology development as a long-term trend and higher requirements for chip function and performance, advanced packaging technologies are becoming increasingly important, as they can integrate multiple chips and components, including digital chips, analog chips, memories, and sensors in a single package. The closer combination of chips with other components in limited space reduces the interconnection distance, thereby improving the data transmission speed and overall performance. Advanced packaging complements advanced processes, pushing further the boundaries of Moore's law and promoting a qualitative leap in the semiconductor industry."