Semiconductors Team

Helen Chiang

General Manager, IDC Taiwan

Galen Zeng

Senior Research Manager, IDC Asia/Pacific

Adela Guo

Research Director

Shane Rau

Research Vice President, Computing Semiconductors

Brandon Hoff

Research Director, Enabling Technologies: Networking and Comm

Phil Solis

Research Director, Connectivity and Smartphone Semiconductors

Nina Turner

Research Director, Semiconductor Technology Supply Chain Intelligence; Enabling Technologies: AI and Automotive Semiconductors

Mario Morales

Group Vice President, Enabling Technologies and Semiconductors

Soo Kyoum Kim

Associate Vice President, Memory Semiconductors

Rudy Torrijos

Senior Research Manager

Jeff Janukowicz

Research Vice President, Solid State Drives and Enabling Technologies

Kuba Stolarski

Research Vice President, Compute Infrastructure and Service Provider Trends, Worldwide Infrastructure Research

Chris Drake

Senior Research Director, Compute Infrastructure and Service Provider Trends, Worldwide Infrastructure Research

Edward Burns

Research Director, Hard Disk Drive and Storage Technologies

Leon Kao

Senior Research Manager, Compute Infrastructure and Service Provider Trends, Worldwide Infrastructure Research

Ashish Nadkarni

Group Vice President and General Manager, Worldwide Infrastructure Research

New Research


  • By:  Adela Guo Loading

    本次IDC市场报告分析了半导体行业的三大趋势,包括新技术、新形势及新应用。新技术包括先进制程、小芯片和第三代半导体。新形势包括地缘政治的变化,如美国、日本、荷兰的联盟,不同国家的支持政策,以及产能布局的变化。新应用包括汽车、数据中心、工业,它们将会是半导体市场主要的增长驱动因素。IDC亚太区研究总监Adela Guo表示:"新的发展趋势正在到来,它将重塑半导体产业链和产业生态系统。"她补充道:"不仅政府应该关注这些新的影响因素,确保国家供应链安全,公司和其他行业利益相关者也必...
  • By: 

    • Phil Solis Loading
    • Shane Rau Loading
    This IDC Pivot Table examines the performance of the mobile phone application processor, tablet application processor, and PC microprocessor markets. The following data is provided quarterly starting from 1Q16:Market size in unitsVendor sha...
  • By:  Adela Guo Loading

    This IDC Market Presentation analyzes the demand changes of AI chips, driven by AI applications. There are four emerging technologies, namely chiplet, RISC-V, photonic chips, and neurotronic chips, which can provide higher performance AI ch...
  • By:  Edward Burns Loading

    This IDC Market Perspective provides a preliminary unit shipment range for worldwide hard disk drive (HDD) units by HDD drive class and estimated supplier market share for 3Q23."Depressed demand from hyperscale datacenter customers is expec...
  • By:  Kuba Stolarski Loading

    At Intel Innovation, the chip maker announced ways in which the company will tackle AI and related workloads holistically, not just through GPU advancements. From advanced CPUs, materials, and packaging to development platforms, much needed...
  • By: 

    • Elisabeth Clemmons Loading
    • Shane Rau Loading
    • Rick Villars Loading
    This IDC Perspective explores the "AI virtual gold rush" and how semiconductor industry dynamics will inform the success of AI strategies. It examines the constraints of the semiconductor industry, how silicon affects the entire IT sector, ...
  • By:  Rudy Torrijos Loading

    This IDC Market Presentation presents updated 3Q23 semiconductor market forecast data for 2022-2027 by annual device, industry, region, and application revenue.IDC's Semiconductor Market Forecast Market Model tracks 50+ semiconductor system...
  • By:  Rudy Torrijos Loading

    This IDC Market Presentation presents updated semiconductor market share data for 2022 by annual vendor, device, region, locality, and industry revenue.IDC's Semiconductor Market Share Market Model tracks 120+ semiconductor companies segmen...
  • By:  Kuba Stolarski Loading

    This IDC Market Presentation offers an overview of the worldwide server market and related trends as of the second quarter of 2023. Detailed results were released on September 7, 2023, in IDC's Worldwide Quarterly Server Tracker and on Sept...
  • By:  Galen Zeng Loading

    隨著科技的持續進步,先進封裝技術已成為半導體產業的一大焦點,而這也是IDC最新研究的核心。IDC預測,2023年全球封裝市場達875.6億美元,先進封裝技術佔比將近50%。這意味著,隨著技術進步和市場需求的增加,先進封裝技術將成為半導體市場的主導。特別是AI、HPC、5G、汽車和物聯網對該技術的需求持續增長,先進封裝技術的市場份額預計在2028年將近60%。本研究報告提供了一個全面的市場分析,包括主要的供應商、技術趨勢、應用領域和競爭情景。值得一提的是,台積電、三星、英特爾和...

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