target audience: TECH SUPPLIER Publication date: Dec 2023 - Document type: Market Presentation - Doc Document number: # US50501923
2023 Worldwide Semiconductor Supply Chain Summary: Fabless, Foundry, OSAT, and Advanced Packaging
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Abstract
This IDC Market Presentation looks at the semiconductor supply chain, in which Fabless, Foundry, and outsourced semiconductor assembly and test services (OSAT) are positioned in the upstream, midstream, and downstream, respectively, working together to complete chip products. As chipset system architectures continue to evolve, advanced packaging is required to complement their designs.
“In 2023, because of market conditions, there was lackluster demand for consumer electronics. However, the AI and high-performance computing (HPC) markets experienced strong demand, and with inventory gradually decreasing in the supply chain, chip market demand is slowly recovering. The semiconductor supply chain is poised to embrace positive market opportunities in 2024,” says Galen Zeng, senior research manager, Semiconductor Research, IDC Asia/Pacific.